We are a hardware startup building an industrial environmental sensor node. We have a working breadboard prototype with an STM32WL, three I2C sensors and a battery management front end. We need to move to a manufacturable 4-layer board.
We need production-intent schematic and layout with a fabrication package that passes DFM at our assembly house first time, and an antenna layout that actually achieves range.
| File | Type | Size | Access |
|---|---|---|---|
| Prototype schematic | 2 MB | NDA required | |
| Enclosure STEP model | STEP | 6 MB | NDA required |
| Current BOM & sourcing notes | XLSX | 1 MB | NDA required |
| Assembler DFM rules | 1 MB | Released to invited engineers |
A milestone is accepted and paid when these are demonstrably met — not when it is merely submitted.
Submitted proposals are normalised into the same axes so they can actually be compared. The platform does not choose for the client — it makes the technical comparison transparent.
Lowest price is not automatically ranked first. Price sits alongside methodology, assumptions, verification and availability, because the cheapest proposal against an incomplete methodology is not the cheapest project.
Each match shows the evidence behind the score — and states what is missing rather than hiding it behind a rank.
We need production-intent schematic and layout with a fabrication package that passes DFM at our assembly house first time, and an antenna layout that actually achieves range.
We need production-intent schematic and layout with a fabrication package that passes DFM at our assembly house first time, and an antenna layout that actually achieves range.
We need production-intent schematic and layout with a fabrication package that passes DFM at our assembly house first time, and an antenna layout that actually achieves range.
We need production-intent schematic and layout with a fabrication package that passes DFM at our assembly house first time, and an antenna layout that actually achieves range.
